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You are here: Home / Topics / Some Problems About PCB Design

Some Problems About PCB Design

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Electronics › Electronics › Some Problems About PCB Design

  • This topic has 3 replies, 2 voices, and was last updated 7 years, 1 month ago by Joseph.
Viewing 4 posts - 1 through 4 (of 4 total)
  • Author
    Posts
  • December 12, 2018 at 7:01 am #4990
    S C Nautiyal
    Participant
    I am looking for a consideration to keep in mind while designing a pcb(Only double sided available) with high speed signals (upto 100MHz). This thought is incomplete,  so I didn't find the right solution from the internet and enough materials to support it.
     
    The questions I have met at present are as follows:
    Would using smds be a better option than through hole components and why?
    If I use smds, I would have to use vias to provide ground is using vias for ground and also other connections a good option?
    What other techniques can be used to minimize the stray capacitances and inductances at high frequency.
     
    If someone can give me more professional advice would really help me. Any Idea  and suggestions would be appreciated.
     
    Thanks,
    Joey
    December 12, 2018 at 7:55 am #14946
    S C Nautiyal
    Participant

    By the way, I have read an article about PCB design info and principle(enclose the link https://www.kynix.com/Blog/482.html), but I think it has a little confused me, as an beginner in this field, I hope to find some materials or info more easily to understand.heart

    December 13, 2018 at 1:53 am #14947
    S C Nautiyal
    Participant

    By the way, I have read an article about PCB design info and principle(enclose the link https://www.kynix.com/Blog/482.html), but I think it has a little confused me, as an beginner in this field, I hope to find some materials or info more easily to understand.

    December 13, 2018 at 10:56 am #14948
    Joseph
    Participant

    For multi-layer PCBs, SMD is better option than THM as it eases routing. THM have only advantage over SMD in case, the attachment has to tolerate mechanical stress. to avoid stray capacitance and inductance, faraday shield is the best option. to minimize impact of high frequency, proper decoupling must be done.

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